Expertise
Engineering & Materials Science
# Fabrication
# Nanoelectronics
# Nanofluidics
# Nanowires
# Silicon
Physics & Astronomy
# Fabrication
# Silicon
# Wafers
Research
Atomic layer deposition (ALD) is a thin-film deposition technique widely used in the semiconductor industry to deposit very thin layers of materials with high uniformity and high conformality. Currently several techniques have been developed and a great variety of materials can be deposited, however for many materials an ALD recipe remains unchartered. In our research the aim is to develop new recipes and use novel techniques to facilitate the ALD of these materials.
Publications
Recent
van der Zouw, K.
, van der Wel, B. Y.
, Aarnink, A. A. I.
, Wolters, R. A. M.
, Gravesteijn, D. J.
, & Kovalgin, A. Y. (2023).
Low-resistivity molybdenum obtained by atomic layer deposition.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films,
41(5), Article 052402.
https://doi.org/10.1116/6.0002804
Jonker, D.
, Kooijman, L., Pordeli, Y.
, van der Wel, B.
, Berenschot, E.
, Borgelink, B.
, Le-The, H.
, de Boer, M.
, Eijkel, J.
, Hueting, R.
, Tiggelaar, R.
, van Houselt, A.
, Gardeniers, H.
, & Tas, N. (2020).
Wafer-scale fabrication and modification of silicon nano-pillar arrays for nanoelectronics, nanofluidics and beyond.
International Journal of Nanotechnology,
17(7-10), 583-606.
https://doi.org/10.1504/IJNT.2020.111322
Kooijman, L. J., Pordeli, Y.
, van der Wel, B. Y.
, Berenschot, J. W.
, Eijkel, J. C. T.
, & Tas, N. R. (2020).
High-performance ceramic EOF pump realized by massively parallel sacrificial silicon nano-pillar moulding. In
23rd International Conference on Miniaturized Systems for Chemistry and Life Sicences: uTAS 2019 (pp. 1188-1189). The Chemical and Biological Microsystems Society.
Pordeli, Y.
, Borgelink, B. T. H.
, van der Wel, B. Y.
, Berenschot, E. J. W.
, Dogan, T.
, de Boer, M. J.
, Bruinink, C. M.
, Zandvliet, H. J. W.
, Gardeniers, H. J. G. E.
, & Tas, N. R. (2019).
Wafer-Scale Self-Aligned Fabrication of Nanometric Curved Tunneling Junctions. In
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 2376-2379). Article 8808559 IEEE.
https://doi.org/10.1109/TRANSDUCERS.2019.8808559
Affiliated Study Programmes
Bachelor
Contact Details
Visiting Address
University of Twente
Drienerlolaan 5
7522 NB Enschede
The Netherlands
Mailing Address
University of Twente
P.O. Box 217
7500 AE Enschede
The Netherlands