Expertise
Testing
System-On-Chip
Sensors
Defects
Fluidics
Digital To Analog Conversion
Hardware
Monitoring
Organizations
Publications
Recent Articles
Kerkhoff, H. G., Ali, G., Ebrahimi, H., & Ibrahim, A. M. Y. (2017). An automotive MP-SoC featuring an advanced embedded instrument infrastructure for high dependability. 65-70. Poster session presented at IEEE International Test Conference Asia, Taipei City, Taiwan, Province of China.DOI: 10.1109/ITC-ASIA.2017.8097113
Ibrahim, A. M. Y., & Kerkhoff, H. G. (2017). A cost-efficient dependability management framework for self-aware system-on-chips based on IEEE 1687. In 2017 IEEE 23rd International Symposium on On-Line Testing and Robust System Design (IOLTS) (pp. 1-2). IEEE. DOI: 10.1109/IOLTS.2017.8046166
Ibrahim, A. M. Y., & Kerkhoff, H. G. (2017). Structured Scan Patterns Retargeting for Dynamic Instruments Access. In 2017 IEEE 35th VLSI Test Symposium (VTS) IEEE. DOI: 10.1109/VTS.2017.7928955
Rohani, A., Ebrahimi, H., & Kerkhoff, H. G. (2016). A software framework to calculate local temperatures in CMOS processors. 183-188. Paper presented at 26th International Workshop on Power and Timing Modeling, Optimization and Simulation, Bremen, Germany.DOI: 10.1109/PATMOS.2016.7833685
Kerkhoff, H. G., & Ebrahimi, H. (2016). Investigation of Intermittent Resistive Faults in Digital CMOS Circuits. Journal of circuits, systems and computers, 25(03), [1640023]. DOI: 10.1142/S0218126616400235
Wan, J. (Ed.), Wan, J. (Ed.), & Kerkhoff, H. G. (2016). Simulating NBTI degradation in arbitrary stressed analog/mixed-signal environments. IEEE transactions on nanotechnology, 15(2), 137-148. DOI: 10.1109/TNANO.2015.2505092
Ibrahim, A. M. Y., & Kerkhoff, H. G. (2016). Efficient Utilization of Hierarchical iJTAG Networks for Interrupts Management. In 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) (pp. 97-102). USA: IEEE Computer Society. DOI: 10.1109/DFT.2016.7684077
Alt, J., Bernardi, P., Bosio, A., Cantoro, R., Kerkhoff, H. G., Leininger, A., ... Strasser, S. (2016). Thermal issues in test: An overview of the significant aspects and industrial practice. In IEEE 34th VLSI Test Symposium (VTS 2016) (pp. 1-4). USA: IEEE. DOI: 10.1109/VTS.2016.7477278
UT Research Information System
Courses
Contact Details
Visiting Address
University of Twente
Faculty of Electrical Engineering, Mathematics & Computer Science
Zilverling
(building no. 11), room 5078
Hallenweg 19
7522NH Enschede
The Netherlands
Mailing Address
University of Twente
Faculty of Electrical Engineering, Mathematics & Computer Science
Zilverling
5078
P.O. Box 217
7500 AE Enschede
The Netherlands