X. Liu (Xingyu)


Liu, X. (2021). Low temperature pure boron layer deposition for silicon diode and micromachining applications. [PhD Thesis - Research UT, graduation UT, University of Twente]. University of Twente. https://doi.org/10.3990/1.9789036552547
Krakers, M., Knezevic, T. , Batenburg, K. M. , Liu, X. , & Nanver, L. K. (2020). Diode design for studying material defect distributions with avalanche-mode light emission. In 2020 IEEE 33rd International Conference on Microelectronic Test Structures, ICMTS 2020 - Proceedings [9107933] (IEEE International Conference on Microelectronic Test Structures; Vol. 2020). IEEE. https://doi.org/10.1109/ICMTS48187.2020.9107933
Knežević, T., Suligoj, T. , Liu, X. , Nanver, L. K., Elsayed, A., Dick, J. F., & Schulze, J. (2019). Back-end-of-line CMOS-compatible diode fabrication with pure boron deposition down to 50 °C. In ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (pp. 242-245). [8901810] (European Solid-State Device Research Conference; Vol. 2019-September). IEEE. https://doi.org/10.1109/ESSDERC.2019.8901810
Nanver, L. K. , Liu, X., & Knezevic, T. (2018). Test structures without metal contacts for DC measurement of 2D-materials deposited on silicon. In ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures (pp. 69-74). (IEEE International Conference on Microelectronic Test Structures; Vol. 2018-March). IEEE. https://doi.org/10.1109/ICMTS.2018.8383767

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University of Twente
Drienerlolaan 5
7522 NB Enschede
The Netherlands

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University of Twente
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7500 AE Enschede
The Netherlands