Carré

K.M. Batenburg BSc (Kevin)

Supporting staff
EEMCS-EE-IDS
Carré C2615
k.m.batenburg@utwente.nl
+31534891644
Business card

Publications

2024
Tuning Nanopores in Tubular Ceramic Nanofiltration Membranes with Atmospheric-Pressure Atomic Layer Deposition: Prospects for Pressure-Based In-Line Monitoring of Pore Narrowing, Article 24. Nijboer, M., Jan, A., Chen, M., Batenburg, K., Peper, J., Aarnink, T., Roozeboom, F., Kovalgin, A., Nijmeijer, A. & Luiten-Olieman, M.https://doi.org/10.3390/separations11010024
2022
A miniature microclimate thermal flow sensor for horticultural applicationsIn 2022 IEEE Sensors, Article 9967348. IEEE. Alveringh, D., Bijsterveld, D. G., Berg, T. E. v. d., Veltkamp, H.-W., Batenburg, K. M., Sanders, R. G. P., Lötters, J. C. & Wiegerink, R. J.https://doi.org/10.1109/SENSORS52175.2022.9967348Miniature robust high-bandwidth force sensor with mechanically amplified piezoresistive readoutIn 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) (pp. 684-687). IEEE. Alveringh, D., van der Ven, D. L., Veltkamp, H.-W., Batenburg, K. M., Sanders, R. G. P., Fernandez Rivas, D. & Wiegerink, R. J.https://doi.org/10.1109/MEMS51670.2022.9699639
2021
Designer Core-Shell Nanoparticles as Polymer Foam Cell Nucleating Agents: The Impact of Molecularly Engineered Interfaces, 17034-17045. Liu, S., de Beer, S., Batenburg, K. M., Gojzewski, H., Duvigneau, J. & Vancso, G. J.https://doi.org/10.1021/acsami.1c00569PureB diode fabrication using physical or chemical vapor deposition methods for increased back-end-of-line accessibility, Article 107938. Thammaiah, S. D., Liu, X., Knežević, T., Batenburg, K. M., Aarnink, A. A. I. & Nanver, L. K.https://doi.org/10.1016/j.sse.2020.107938
2020
Diode design for studying material defect distributions with avalanche-mode light emissionIn 2020 IEEE 33rd International Conference on Microelectronic Test Structures, ICMTS 2020 - Proceedings, Article 9107933. IEEE. Krakers, M., Knezevic, T., Batenburg, K. M., Liu, X. & Nanver, L. K.https://doi.org/10.1109/ICMTS48187.2020.9107933RFID Tag Failure after Thermal OverstressIn 2019 IEEE International Integrated Reliability Workshop, IIRW 2019, Article 8989885. IEEE. Ozturk, E., Dikkers, M. J., Batenburg, K. M., Salm, C. & Schmitz, J.https://doi.org/10.1109/IIRW47491.2019.8989885

Research profiles

Address

University of Twente

Carré (building no. 15), room C2615
Hallenweg 23
7522 NH Enschede
Netherlands

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