Expertise
Engineering & Materials Science
# Boron
# Chemical Vapor Deposition
# Core Shell Nanoparticles
# Diodes
# Light Emission
# Physical Vapor Deposition
Chemistry
# Physical Vapour Deposition
# Thermal Cycling
Organisations
Publications
Recent
Alveringh, D., Bijsterveld, D. G., Berg, T. E. V. D.
, Veltkamp, H-W.
, Batenburg, K. M.
, Sanders, R. G. P.
, Lötters, J. C.
, & Wiegerink, R. J. (2022).
A miniature microclimate thermal flow sensor for horticultural applications. In
2022 IEEE Sensors [9967348] IEEE.
https://doi.org/10.1109/SENSORS52175.2022.9967348
Alveringh, D.
, van der Ven, D. L.
, Veltkamp, H-W.
, Batenburg, K. M.
, Sanders, R. G. P.
, Fernandez Rivas, D.
, & Wiegerink, R. J. (2022).
Miniature robust high-bandwidth force sensor with mechanically amplified piezoresistive readout. In
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) (pp. 684-687). IEEE.
https://doi.org/10.1109/MEMS51670.2022.9699639
Liu, S.
, de Beer, S.
, Batenburg, K. M.
, Gojzewski, H.
, Duvigneau, J.
, & Vancso, G. J. (2021).
Designer Core-Shell Nanoparticles as Polymer Foam Cell Nucleating Agents: The Impact of Molecularly Engineered Interfaces.
ACS Applied Materials and Interfaces,
13(14), 17034-17045.
https://doi.org/10.1021/acsami.1c00569
Thammaiah, S. D.
, Liu, X., Knežević, T.
, Batenburg, K. M.
, Aarnink, A. A. I.
, & Nanver, L. K. (2021).
PureB diode fabrication using physical or chemical vapor deposition methods for increased back-end-of-line accessibility.
Solid-state electronics,
177, [107938].
https://doi.org/10.1016/j.sse.2020.107938
Krakers, M., Knezevic, T.
, Batenburg, K. M.
, Liu, X.
, & Nanver, L. K. (2020).
Diode design for studying material defect distributions with avalanche-mode light emission. In
2020 IEEE 33rd International Conference on Microelectronic Test Structures, ICMTS 2020 - Proceedings [9107933] (IEEE International Conference on Microelectronic Test Structures; Vol. 2020). IEEE.
https://doi.org/10.1109/ICMTS48187.2020.9107933
Ozturk, E.
, Dikkers, M. J.
, Batenburg, K. M.
, Salm, C.
, & Schmitz, J. (2020).
RFID Tag Failure after Thermal Overstress. In
2019 IEEE International Integrated Reliability Workshop, IIRW 2019 [8989885] IEEE.
https://doi.org/10.1109/IIRW47491.2019.8989885
UT Research Information System
Contact Details
Visiting Address
University of Twente
Faculty of Electrical Engineering, Mathematics and Computer Science
Carré
(building no. 15), room C2615
Hallenweg 23
7522NH Enschede
The Netherlands
Mailing Address
University of Twente
Faculty of Electrical Engineering, Mathematics and Computer Science
Carré
C2615
P.O. Box 217
7500 AE Enschede
The Netherlands