Lei Wang received the B.Sc. degree in mechanical engineering from Xiamen University, Xiamen, China, in 2017, and the M.Sc. degree in computation engineering from Ruhr University, Bochum, Germany, in 2020. He is currently working toward the Ph.D. degree in thermomechanical design of heterogeneous integrated power module with the Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), Twente University, Enschede, The Netherlands. He is recently committed to using pressure contact technology to improve the reliability of Wide Bandgap (WBG) devices. His research interests include design of power modules, multi-physical fields simulation, and reliability on power cycling.
Organisations
2013-2017 Bachelor  Mechanical engineering from Xiamen University, Xiamen, China.
2017-2020 Master   Computation engineering from Ruhr University, Bochum, Germany.
2020-Present PhDÂ Â Â Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), Twente University, Enschede, The Netherlands.
1. A Fabrication process for Heterogeneous Integrated Power Modules
It is not possible to exploit the full potential of WBG (Wide Bandgap) based power electronics with existing manufacturing technology. New emerging WBG power devices are switching extremely fast, have very low conduction losses and can readily be integrated in a SiP (System in Package). In this project a new manufacturing process will be developed that eliminates component packaging by doing packaging on circuit level, not only for integrating the semiconductor devices, but also the capacitive and inductive elements that are needed for commutation loops and filter networks for power conversion and EMI filtering.
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