Expertise
Engineering
- High Aspect Ratio
- Lithography
- Silicon
- Demonstrates
- Dimensional Control
- High Density
- Machining
- Silicon Wafer
Organisations
Publications
2020
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography, Article 25. Ni, S., Berenschot, E. J. W., Westerik, P. J., de Boer, M. J., Wolf, R., Le-The, H., Gardeniers, H. J. G. E. & Tas, N. R.https://doi.org/10.1038/s41378-020-0134-6
Research profiles
Address
University of Twente
Nanolab (building no. 16), room 1011
Hallenweg 23
7522 NH Enschede
Netherlands
University of Twente
Nanolab 1011
P.O. Box 217
7500 AE Enschede
Netherlands
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