Expertise
Engineering
- High Aspect Ratio
- Lithography
- Silicon
- Demonstrates
- Dimensional Control
- High Density
- Machining
- Silicon Wafer
Organisations
Publications
2020
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography (2020)Microsystems & nanoengineering, 6(1). Article 25. Ni, S., Berenschot, E. J. W., Westerik, P. J., de Boer, M. J., Wolf, R., Le-The, H., Gardeniers, H. J. G. E. & Tas, N. R.https://doi.org/10.1038/s41378-020-0134-6
Research profiles
Address
University of Twente
Nanolab (building no. 16), room 1011
Hallenweg 23
7522 NH Enschede
Netherlands
University of Twente
Nanolab 1011
P.O. Box 217
7500 AE Enschede
Netherlands
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